In semiconductor photolithography, the uniformity of photoresist resin dispersion directly determines the resolution and yield of chip patterns. Ultrasonic dispersion equipment, with its unique technological advantages, has become a key piece of equipment for overcoming the limitations of traditional stirring. Its application in photoresist resin processing is driving the fabrication of precision electronic materials into a new stage of micron-level control.
The core advantage of ultrasonic dispersion equipment stems from its unique working principle. The equipment converts electrical energy into high-frequency mechanical vibrations of 20kHz to 60kHz through a transducer, creating an alternating pressure field in the liquid medium and generating a large number of tiny cavitation bubbles. The enormous energy released when these bubbles collapse instantaneously generates strong microjets and shear forces, breaking down the particle agglomeration structure in the photoresist resin at the microscopic level. This dispersion method overcomes the physical limitations of traditional mechanical stirring that relies on blade rotation, precisely controlling the dispersion action at the nanoscale, perfectly meeting the stringent requirements of controlling the 0.1-1μm particle size of photoresist resin.
Compared to traditional stirring techniques, ultrasonic dispersion equipment exhibits irreplaceable precision advantages in photoresist resin processing. Traditional mechanical stirring is prone to uneven particle size due to inconsistent shear forces, while ultrasonic equipment can dynamically control the resin dispersion state by adjusting power and frequency in real time, in conjunction with an online particle size monitoring system. During the mixing of resin with photosensitizers and solvents, its non-contact operation avoids cross-contamination and eliminates bubbles and agglomeration generated by traditional stirring, ensuring uniform integration of all components. Experiments show that photoresist treated with ultrasonic dispersion forms a smoother film during spin coating, with a significantly reduced coefficient of variation in coating thickness.
The synergistic application of ultrasonic dispersion equipment and traditional stirring is becoming an optimization direction. First, mechanical stirring achieves macroscopic mixing of the resin system, followed by deep dispersion using ultrasound. This reduces energy consumption and avoids the uneven energy distribution problems caused by ultrasound alone. This combined process is particularly important in the preparation of advanced photoresists, ensuring the photosensitivity and resolution of the photoresist and meeting the stringent requirements for linewidth uniformity in chip manufacturing.
As the semiconductor industry moves towards smaller manufacturing processes, the demand for dispersion precision in photoresist resins continues to increase. Ultrasonic dispersion equipment, with its high efficiency, controllability, and stability, is becoming a core supporting technology in the photoresist preparation process, providing a reliable guarantee for the precise "sculpting" of microscopic materials and helping the precision manufacturing industry overcome technological bottlenecks.
