In the field of precision electronics manufacturing, the quality of pigment dispersion in high-viscosity photoresist directly determines the resolution and yield of chip lithography processes. Traditional dispersion methods often face challenges such as uneven shear force, wide particle distribution, and impurity introduction when dealing with these high-viscosity systems. High-shear ultrasonic dispersion equipment, with its unique technological advantages, has become a key piece of equipment for overcoming the bottleneck in high-viscosity photoresist pigment dispersion.
The core advantage of high-shear ultrasonic dispersion equipment stems from the synergistic effect of ultrasonic cavitation and high-frequency shear. The equipment uses piezoelectric crystals to convert electrical signals into high-frequency mechanical vibrations of 20kHz-100kHz, creating countless tiny cavities in the high-viscosity photoresist system. When these cavities expand and close instantaneously, they release impact forces and microjets of thousands of atmospheres, which can both break up the adsorption and aggregation between pigment particles and refine the particles to the nanoscale. Unlike traditional equipment that relies on abrasive media, its media-free dispersion method avoids wear and impurity contamination from the source, ensuring the purity of the photoresist.
This equipment achieves precise control of the dispersion process, specifically addressing the characteristics of high-viscosity systems. Through an online particle size monitoring system that provides real-time feedback on particle size and distribution, operators can dynamically adjust the ultrasonic frequency and amplitude, controlling particle displacement with nanometer-level precision. This refined control not only solves the problem of uneven shear force transmission in high-viscosity materials but also suppresses abnormal temperature rises during dispersion. Compared to traditional grinding equipment, which suffers from localized overheating due to mechanical energy conversion, ultrasonic dispersion provides more uniform energy transmission, effectively reducing solvent evaporation and formulation variations.
In practical applications, this equipment significantly improves the core performance of photoresists. The uniformity of pigment particle size treated by the equipment is greatly enhanced, enabling photoresist photosensitivity and resolution to meet precision manufacturing requirements. Simultaneously, the ultrasonic action reduces the apparent viscosity of high-viscosity systems, decreasing the amount of dispersant required and optimizing coating smoothness while lowering production costs. More importantly, the equipment ensures batch-to-batch consistency through stable dispersion effects. Thermogravimetric analysis shows minimal fluctuations in pigment load in the treated dispersion system, meeting the quality control requirements of large-scale production.
As chip manufacturing processes advance to more advanced nodes, the requirements for dispersion precision in high-viscosity photoresists continue to increase. High-shear ultrasonic dispersion equipment, with its high efficiency, precision, and cleanliness, not only overcomes the limitations of traditional processes but also drives the upgrading of photoresist material performance. In the process of domestic production of semiconductor materials, this equipment is becoming an important support for improving the manufacturing level of high-end photoresists, injecting key momentum into technological breakthroughs in the precision electronics industry.
